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Highlights

Optical Packaging

Application Digital Imaging

Silicon based devices such as MEMS, CCD/CMOS sensors or LCOS microdisplays are packaged with cover glasses. These cover glasses consist of clean surfaces plus functional coatings - such as AR coatings, NIR blocking filters or index matched ITO - and in some cases chrome apertures, solderable frames or B-stage epoxy frames for packaging solutions. A key factor of sensor lids is superior low defect properties of the coatings as they define the quality of the device. Sealing or bonding solutions for the subsequent assembly process are an integral part of the products offered. 

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Coating Plus - More than just coating

Coating Plus

Sophisticated optical thin film components and sub-systems require additional process steps beyond coating.

  • Bonding and Sealing
  • Patterning Solutions
  • Marking Solutions
  • Wafer Dicing and Scribing
  • Packaging and Handling
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