B-stage Epoxy

An additional assembly solution for light sensitive semiconductor devices is offered by B-stage epoxy. A B-stage epoxy frame on the lid simplifies the assembly process: the lid is shipped with the epoxy frame in a dry state. In a defined curing cycle at 100°C to 130°C it is sealed with the sensor device. The epoxy is applied to the lids with precise patterns and high cosmetic standards. The epoxy frame may also function as a low reflectance black aperture.