Most silicon based devices such as MEMS, CCD/CMOS sensors or LCOS microdisplays are packaged with cover glasses. These cover glasses consist of clean surfaces plus functional coatings - such as AR coatings, NIR blocking filters or index matched ITO - and in some cases chrome apertures, solderable frames or B-stage epoxy frames for packaging solutions.
A key factor of sensor lids is superior low defect properties of the coatings as they define the quality of the device. Sealing or bonding solutions for the subsequent assembly process are an integral part of the products offered.
Low Defect Solutions for Optical Packaging
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Cover Glass Function
- Efficient transmission of light and blocking of parasitic radiation – low defect anti-reflection coatings or filter coatings
- Protection of the devices – standard and special glass types
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Sealing of the devices – B-stage epoxies, solderable coatings, other sealing technologies upon request.
- Masking and shielding of light path – chromium frames and apertures
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Single part processing of optical lids is the premier solution whenever cleanliness and high flexibility for customized sizes and patterns are required. The lid substrates are individually processed in final size to avoid dicing steps which are critical with respect to low defect requirements.
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A coated glass wafer is the cutting edge technology for high volume optical packaging. The glass wafer is bonded to the silicon wafer before dicing. Some of the applications require a spacer between the two wafers. Optics Balzers provides glass wafers with low defect optical coatings – if required with chrome apertures for light beam shaping.
All Datasheets Lids / Windows
